India Semiconductor Mission
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Current affairsIndia-Belgium Joint Statement 2026: Investment Fast-Track Mechanism, IMEC Semiconductor Partnership, and Defence CooperationBelgian Prime Minister Bart De Wever visited India (September 2–4, 2026) — the first Belgian PM visit in two decades — and issued a comprehensive Joint Statement. India and Belgium set a target of doubling bilateral trade from approximately USD 13 billion, established an Investment Fast-Track Mechanism, announced IMEC semiconductor research collaboration, and signed a defence Letter of Intent covering exchanges, staff talks, and joint production. Current affairsSemicon 2.0 Notified: India's ₹1,27,500-Crore Semiconductor Mission Phase 2 — Indigenous Chip Design, 3-nm Roadmap, and Semiconductor SovereigntyThe Government of India formally notified Semicon 2.0 on August 31, 2026 — a ₹1,27,500-crore programme that expands the semiconductor ecosystem from chip assembly to indigenous design, intellectual property creation, advanced packaging, equipment, materials, research, and talent. India aims to domestically design and manufacture chips for 70–75% of its needs by 2029 and reach 3-nanometre and 2-nanometre technology nodes by 2035. Current affairsMobile Phone Manufacturing Scheme (MPMS) 2026: MeitY's ₹62,500 Crore Push for Deep-Value Assembly and Indian BrandsThe Union Cabinet approved and MeitY notified the Mobile Phone Manufacturing Scheme (MPMS) on 22 August 2026, with an outlay of ₹62,500 crore over five years (FY2026-27 to FY2030-31). The scheme goes beyond the earlier PLI for Mobile Phones by specifically incentivising domestic component sourcing (up to 1.5% bonus) and Indian-owned brand R&D (additional 3% incentive), aiming to raise India's domestic value addition in mobile manufacturing from ~15% to over 35% by 2031. Current affairsElectronics Component Manufacturing Scheme (ECMS) 2026: India's ₹40,000 Crore Push to Build a Domestic Component EcosystemThe Electronics Component Manufacturing Scheme (ECMS), approved by the Union Cabinet on March 28, 2025 and notified on April 8, 2025, targets India's electronics component supply chain gap with an enhanced outlay of ₹40,000 crore (Union Budget 2026-27). By August 2026, 106 projects worth ₹69,548 crore have been approved, targeting 74,628 direct jobs and production of ₹4.5 lakh crore worth of components over six years. Current affairsSEMICON India 2026 and India Semiconductor Mission (ISM) 2.0: ₹1.27 Lakh Crore Push — Silicon to Systems StrategyThe Union Cabinet approved India Semiconductor Mission (ISM) 2.0 in July 2026 with a ₹1.27 lakh crore outlay, expanding India's chip ambition from assembly to full-stack design, fabrication, and packaging. SEMICON India 2026 — the 5th edition of the flagship semiconductor conference — is set for September 17–19 at Yashobhoomi, New Delhi, with PM Modi to inaugurate and 500+ global exhibitors participating.
In previous-year questions
- Consider the relationship between ECMS and India's broader electronics manufacturing ecosystem: 1. India Semiconductor Mission (ISM) covers semiconductor chips; ECMS covers electronic components. 2. PLI for Large-Scale Electronics Manufacturing covers finished goods like smartphones. 3. ECMS components cover approximately 90% of a smartphone's Bill of Materials. 4. The enhanced ECMS outlay in Union Budget 2026-27 was raised to ₹76,000 crore. Which statements are correct?UPSC · Current Affairs
- The India Semiconductor Mission (ISM) 2.0, approved by the Union Cabinet in July 2026 with an outlay of ₹1.27 lakh crore, is structured around six strategic pillars. Which of the following is NOT one of those six pillars?UPSC · Current Affairs
- SEMICON India 2026, the fifth edition of India's flagship semiconductor conference scheduled for September 17–19 at Yashobhoomi, New Delhi, is jointly organised by which two bodies?UPSC · Current Affairs
- Under India's semiconductor policy, the Design Linked Incentive (DLI) Scheme provides financial support of up to ₹30 crore per company over five years to support which category of companies?UPSC · Current Affairs
- Under ISM 1.0 (the first phase of India Semiconductor Mission, 2021), what was the maximum capital subsidy offered to semiconductor fabrication (fab) units as a percentage of project cost?UPSC · Current Affairs
- The Mobile Phone Manufacturing Scheme (MPMS), notified by MeitY on 22 August 2026, carries what total financial outlay over five years (FY2026-27 to FY2030-31)?UPSC · Current Affairs
- The Government of India formally notified Semicon India Programme 2.0 (Semicon 2.0) in August 2026. Which of the following statements about Semicon 2.0 is/are correct? 1. Its total financial outlay is ₹1,27,500 crore. 2. It provides 40% fiscal support for silicon wafer fabrication facilities. 3. It is implemented by the Ministry of Heavy Industries through the National Electronics Mission. Select the correct answer using the code below:UPSC · Current Affairs
- With reference to India's semiconductor ecosystem, which of the following pairs is/are correctly matched? 1. Tata Electronics-PSMC fab — Dholera, Gujarat 2. Micron Technology assembly plant — Pune, Maharashtra 3. India Semiconductor Mission (ISM) — under Ministry of Electronics and Information Technology (MeitY) Select the correct answer:UPSC · Current Affairs
- IMEC (Interuniversity Microelectronics Centre), whose semiconductor research collaboration with India was announced in September 2026, is headquartered in which country?UPSC · Current Affairs